Chip Quik EGS10C-20G Electronics Grade Silicone Adhesive...


Price: $6.95
(as of Jun 18,2022 21:16:04 UTC – Details)

Lead-Free / RoHS 3 Compliant / REACH Compliant Product Highlights Safe for Use With Electronics Seals, Bonds, Encapsulates Resistant to Various Chemicals and Oils Non-Corrosive, Non-Conductive Flexible, Durable, Non-Degrading Withstands Moisture, Vibration, Abrasion Common Uses Protecting, Sealing and Insulating Corrosion Sensitive Electronic Components and Electrical Materials. OEM Commercial and Industrial Manufacturing for Flexible Permanent Bonding and Sealing. Instructions Surfaces should be clean and dry. Unscrew cap, cut the tip off. If tooling is required, do so within the first 10 minutes after dispensing. Apply the silicone to surfaces and remove the excess silicone after tooling with a dry clean cloth. Allow the silicone to cure completely. At room temperature, 25C (77F), and 50% relative humidity, the silicone will skin in 10 minutes and fully cure in 24 hours (1/8″ bead). The silicone will reach its maximum adhesion in 7 days. Higher humidity accelerates curing. Specifications Meets and Exceeds: ASTM C920, UL Recognized VOC: VOC Compliant (<3%), Low Odor Operating Temperature Range: -57C to +204C (-70F to +400F) Curing Time: 10 min (skin), 24 hours (full cure), 7 days (max adhesion) Color: Clear Size: 20g Squeeze Tube Storage and Handling Store refrigerated or at room temperature 3-25C (37-77F). Shelf Life >36 months Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product’s stated shelf life.
Is Discontinued By Manufacturer ‏ : ‎ No
Package Dimensions ‏ : ‎ 5 x 3 x 0.5 inches; 0.8 Ounces
Date First Available ‏ : ‎ March 11, 2019
Manufacturer ‏ : ‎ ChipQuik
Country of Origin ‏ : ‎ USA

Electronics Grade, Silicone, Adhesive, Sealant


There are no reviews yet.

Be the first to review “Chip Quik EGS10C-20G Electronics Grade Silicone Adhesive...”

Your email address will not be published.